Multi-Chip Die Bonding

Key Specifications - Die handling of between 0.25 mm and 50 mm edge length
Placement accuracy of 10 µm@3Sigma, cmk: 1.33
Operator Friendly - Despite the wide range of fittings and set-up options, operation of the 2200 apm is easy to learn. Data transfer via the TCP/IP network is naturally implemented and the user interface is menu-driven.
Flexibility - Even the standard module of Datacon die bonding can be very variably equipped
Due to offline programming the time saving achieved on programming at the production machine is between 50 and 75%

Online Die Bonding Technology by die-bonding.net